At Amphenol Printed Circuits, we take pride in designing and manufacturing advanced printed circuit board solutions that power the world’s most demanding technologies. As part of the global Amphenol family, we bring together decades of engineering expertise and innovation to deliver high-performance, high-reliability interconnect solutions across industries such as aerospace, defense, telecommunications, industrial, and high-speed computing. We specialize in developing complex multilayer, rigid, and rigid-flex circuit boards that meet exacting standards for precision, durability, and signal integrity. Our engineering teams work closely with customers from concept through production, ensuring each design is optimized for manufacturability, thermal performance, and electrical efficiency. We operate advanced fabrication facilities equipped with leading-edge imaging, drilling, and lamination technologies that allow us to produce fine-line circuitry, controlled impedance structures, and high-density interconnect (HDI) configurations. Our capabilities extend to quick-turn prototyping, high-mix low-volume manufacturing, and full-scale production, giving our clients flexibility and speed to market. We are committed to excellence in every layer of what we build—combining innovative materials, tight process control, and rigorous testing to ensure our circuit boards perform flawlessly in mission-critical environments. Through continuous investment in research and technology, we strengthen our role as a trusted partner in the evolution of electronic systems that connect and shape the modern world.